Responsibilities
•Package development of novel processes and platform for automotive application (Exterior, Interior, IR sensing) 
•Expert in key process development
•Expert in product platform development
•Sustainable, systematic solving of complex problems to improve package performance and identify the root cause, and cooperation with chip R&D and QC

Who we are looking for
•University degree in chemistry, physics, materials science or a comparable natural science course
•Several years of experience in research and development of novel process and platform for automotive, who is understand automotive application field
•In-depth knowledge of material and package process
•Analytical strengths & ability to solve technically complex problems
•Extraordinary ability to innovate